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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-110HRF/9UG-CT
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LG-110HRF/9UG-CT B 25 - May - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process.
Descriptions:
1. The LG-110HRF/9UG SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use.
Device Selection Guide:
COLOR PART NO MATERIAL AlGaInP AlGaInP Emitted Red Green Water Clear Lens
LG-110HRF/9UG-CT
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 2/11
Package Dimensions
Cathode Mark
0.6 1.5 0.5 1 2 1.0
Resin
2
1 0.6
0.8 4 DIE2 0.6
3.2 DIE1 0.6 3 4 0.4 4 3
Soldering Terminal
0.4
PCB
1,2
9UG
4 3
HRF
Note : 1.All dimension are in millimeter tolerance is O 0.1mm unless otherwise noted. 2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.0 0.9 1,2
Cathode
1.5
5.0
4 1.0
3 1.0
1.5
Note : The tolerances unless mentioned is O 0.1mm,AngleO 0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 3/11
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol HRF PD IFP IF Ir ESD Topr Tstg Tsol 72 90 30 10 2000 -40 ~ +85 -40 ~ +90 Max 260J for 5 sec Max 9UG 78 60 30 mW mA mA UNIT
g A V J J
Typical Electrical & Optical Characteristics (Ta=25 J )
Items Luminous Intensity Symbol
HRF
Min. Typ. 32 20 70 40 642 575 630 574 20 20 ------120 120
Max. UNIT ---mcd ---------------------2.4 V nm nm nm
CONDITION IF=20mA
Iv
9UG HRF ----
Peak Wavelength
f P
9UG ---HRF ---9UG ----
IF=20mA
Dominant Wavelength
fD
IF=20mA
Spectral Line Half-Width
f
HRF ---9UG ----
IF=20mA
Forward Voltage
HRF 1.5
VF
9UG 1.7
IF=20mA
2.6 ------deg IF=20mA
Viewing Angle
2c 1/2
HRF ---9UG ----
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-192HRF/9UG-CT Page 4/11
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 1.5 2.0 2.5 3.0
3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA Normalize@25J
-40 -20 -0 20 40 60 80 100
Forward Voltage@20mA Normalize @25J
2.5 2.0 1.5 1.0 0.5 0 -40
1.1
1.0
0.9 0.8
-20
0
20
40
60
80
100
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0.5
0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-192HRF/9UG-CT Page 5/11
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
Relative Intensity Normalize @20mA
2.0 3.0 4.0 5.0
100
2.5 2.0 1.5 1.0 0.5 0
10
1.0
0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA Normalize @25J
-40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normaliz @25J
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40
1.1 1.0 0.9
0.8
-20
0
20
40
60
80
100
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity @20mA
1.0
0.5
0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 6/11
Carrier Type Dimensions
0.25 1.75 3.50.2 3.4 Polarity
4.00.2
2.0
1.5
8.00.3 5.3
1.25
4.00.2
1.87
Note : The tolerances unless mentioned is O 0.1mm,Angle O 0.5. Unit=mm.
E Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No. LG-110HRF/9UG-CT
Description 8.0mm tape,7"reel
Quantity/Reel 3000 devices
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 7/11
Label Explanation
uOql u*~N /|- 1/2
LIGITEK LED
BIN P : Red Chip Luminous Intensity BIN N : Green Chip Luminous Intensity HUE 30 : Red Chip Dominant Wavelength
VF:1.6 - 2.4
LIGITEK ELECTRONICS CO., LTD.
PART NO. : LG-110HRF/9UG-CT LOT NO. : MC9400418 Q'TY(PCS) : 3000 PCS BIN/HUE : P/30-N/8
VF:1.8 - 2.6
HUE 8 : Green Chip Dominant Wavelength 1.8 - 2.6 : Forward Voltage
Brighness Code For Visible SMD (mcd) at 20mA
MIN MAX
Color Code For Visible SMD (nm) at 20mA
MIN MAX
Group
Group
29 30
HRF
624 627 630 633 568 570 572 574 576
627 630 633 636 570 572 574 576 578
N
HRF
32 50 20 32
50 80 32 50
9UG
P M
9UG
31 32 7 8 9 10 11
N
Reel Dimensions
2.0O 0.5
0.8
0.6
0.4
0.2
178O 1.5
6.0O 1.0
0.4
r 13.5O 1.0
0.2
0.6
0.8
9.0O 1.0 12.0O 1.0
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Page 8/11
Box Explanation
1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H W
L
3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Recommended Soldering Conditions
1.
Hand Solder Basic spec is O
Page 9/11
280J 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260J 245O 5J within 5 sec Preheat
120 ~ 150J
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp. (J ) 240
Rising +5J /sec Cooling -5J /sec
150 120
Preheat
60 ~ 120 sec
5sec
Time
3-2 PB-Free Reflow Solder
1~5 C/sec 260 C MaX. 10sec.Max
Preheat 180~200 C 1~5 C/sec
Above 220 C 60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Precautions For Use: Storage time:
1.The operation of Temperatures and RH are : 5 J ~35J ,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 J ~ 35J ,RH60%, they should be treated at 60JO 5 J fo r 15hrs.
Page 10/11
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110HRF/9UG-CT Reliability Test: Page 11/11
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Reference Standard
MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test Endurance Test Low Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008 JIS C 7021: B-10
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature High Humidity Storage Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=1000hrs O 2hrs
MIL-STD-202F:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO 5J (10min) (10min) 2.total 10 cycles
MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4
Solderability Test
1.T.Sol=235 JO 5J 2.Immersion time 2 O 0.5sec 3.Coverage U 95% of the dipped surface
Environmental Test
Temperature Cycling
1.105J ~ 25 J ~ - 55J ~ 25J 30mins 5mins 30mins 5mins 2.10 Cyeles
IR Reflow
1.T=260 C Max. 10sec.Max. 2. 6 Min
MIL-STD-750D:2031.2 J-STD-020

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